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High-K dielectric refers to a material with a high dielectric constant. The High-k is used in semiconductor manufacturing processes to replace the silicon dioxide within gate dielectrics. By implementation of the material, high-k further lowers the die size of processors. The technology is currently used in the Penryn Intel Processors.

IBM and partners have the lead with the implementation of HKMG high-k metal gate. IBMs semiconductor manufacturing has lead to the 32nm wafer. By implementing the 32nm technology they have found a 35 percent increase in performance compared to the 45nm process. The 32nm also consumed between 30 to 50 percent less power.

IBMs implementation of the high-k/metal gate within transistors that controlled primary on/off switching functionality lead to the development of 32nm chip circuitry. Intel Have already shown the 45nm process, so is there any point in upgrading your processor? Intel will no-doubt be designing their 35nm process.

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Tags: Microprocessor

This entry was posted on Monday, April 14th, 2008 at 5:34 pm and is filed under Microprocessors. You can follow any responses to this entry through the RSS 2.0 feed. You can leave a response, or trackback from your own site.