AMD or Intel for Cray HPC
Tuesday, April 29th, 2008Cray has decided to develop its future HPC around Intel’s silicon. This has become a problem for AMD. Cray did in fact have fabrications from AMD which included XT3, XT4 and XT5. Unfortunately for AMD the organisation was hoping that Cray would strike a 5 year deal with the company securing their current status in the market. Cray have now made a 5 year deal with Intel for HPC which is a massive blow for AMD.
Crays development has been centred round building custom interconnects supporting multiple AMD chips through hypertransport (AMD interconnect). Intel has a rival technology called quickpath possible for their new Larrabee and Nehalem products.
Cray are hoping to combine their efforts. Cray will be using Intels Quickpath along with their own high-bandwidth memory subsystems. They are hoping this will give them a significant leap forward in high performance computational tasks. The result? an exaflop! One quadrillion operations a second, I’ve only heard of TeraFlops!
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